China's semiconductor quantum computing chip packaging technology has entered a new stage

Recently, the media learned from the Anhui Provincial Key Laboratory of Quantum Computing Chips that a Chinese scientific research team has successfully developed the first-generation commercial-grade semiconductor quantum chip circuit carrier. This board can support the packaging and testing requirements of 6-bit semiconductor quantum chips at most, so that semiconductor quantum chips can interact with other key core components of quantum computers more efficiently, and will give full play to the powerful performance of semiconductor quantum chips. According to the data, the quantum chip carrier board is an indispensable part of the quantum chip package. It can provide basic support and signal connection for the semiconductor quantum chip. The circuits and devices integrated on it can effectively improve the signal-to-noise reading of the qubit signal. Ratio and readout fidelity to ensure stable operation of the quantum chip. However, quantum chip carrier boards require large capital investment, high technical barriers, and difficult research and development. At present, only a Danish quantum computing hardware company can produce semiconductor quantum chip carrier boards. Jia Zhilong, deputy director of the Anhui Provincial Key Laboratory of Quantum Computing Chips, said, "The development of this semiconductor quantum chip circuit carrier can greatly save my country's R&D and production costs in the semiconductor quantum computing technology route, and also marks the entry of my country's semiconductor quantum computing chip packaging technology A whole new stage." Reposted from: International Electronic Commerce, automatically translated by Google

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Ministry of Education: In response to the

Huai Jinpeng pointed out that the Ministry of Education will cultivate a number of major scientific and technological projects centering on strategic, basic and leading industries such as integrated circuits, industrial motherboards, instruments and meters, and biomedicine, and concentrate efforts on scientific research. Huai Jinpeng said that in response to national urgent needs and major national strategies, we will promote cooperation with relevant national departments to further solve the problem of "stuck neck" in core technologies. At present, integrated circuits, as the foundation and core of the modern information technology industry, are widely used in various electronic products. They are an indispensable part of the information age and have become a strategic, basic, and leading industry for national economic and social development. Although with policy support and market development, China's integrated circuit industry has accumulated a certain industrial foundation and advantages, but some "stuck neck" technologies are still subject to others. The fundamental reason is that the problem of talents has become one of the key factors restricting the development of my country's semiconductor industry. In order to alleviate the shortage of talents in my country's integrated circuit industry, the exemplary microelectronics college has become an important mechanism for the cultivation of integrated circuit talents in my country. The data shows that from 2015 to 2018, the number of students enrolled in the national "26+1" demonstration microelectronics colleges has risen steadily, and stable output can basically be achieved. However, for now, there is still room for optimization of high-level and innovative high-level talents in the semiconductor field in my country. To this end, in recent years, many well-known colleges and universities in my country have successively established integrated circuit colleges to train high-quality and sophisticated talents in the semiconductor industry, including Peking University, Tsinghua University, Huazhong University of Science and Technology, Sun Yat-sen University, Nanjing University of Posts and Telecommunications, Guangdong Industrial University, etc. At present, all major universities and enterprises are strengthening cooperation with each other. For example, Guangdong University of Technology has successively established joint innovation laboratories with Huawei, Allwinner Technology, Cansemi Semiconductor, and five electronics institutes of the Ministry of Industry and Information Technology; University of Science and Technology of China and Hefei University of Technology Sign a joint training agreement to jointly cultivate high-level chip talents. It is worth mentioning that, in response to the urgent needs of the country and the "stuck neck" of major national strategic core technologies, the Ministry of Education proposed to overcome a number of key core technologies urgently needed by the national strategy in the key core technology fields, and effectively improve the industrial chain, supply chain resilience and Competitiveness, a group of high-level research universities have become talent centers and innovation highlands with world influence, and become the core force supporting a strong education, science and technology, and talent power. Reposted from: International Electronic Commerce, automatically translated by Google

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How to improve the reliability of electronic components?

Five departments, including the Ministry of Industry and Information Technology, the Ministry of Education, the Ministry of Science and Technology, the Ministry of Finance, and the State Administration for Market Regulation, recently jointly issued the "Implementation Opinions on Improving the Reliability of the Manufacturing Industry", proposing to focus on the strategic goals of manufacturing a strong country and a strong quality country, focusing on machinery and electronics. , automobiles and other key industries, benchmark the advanced level of similar international products, make up for the shortcomings of basic product reliability, improve the reliability level of complete machine equipment, strengthen the reliability professional talent team, and form a group of products with high reliability and strong market competitiveness , A manufacturing enterprise with a strong brand influence. By 2025, the reliability level of key core products in key industries will be significantly improved, the reliability standard system will be basically established, the quality and reliability management capabilities of enterprises will be continuously enhanced, the reliability test verification capabilities will be greatly improved, and the professional talent team will continue to grow. Build 3 or more reliability common technology research and development service platforms, form more than 100 typical demonstrations of reliability improvement, and promote more than 1,000 enterprises to implement reliability improvement. By 2030, the reliability level of 10 key core products will reach the international advanced level, the leading role of reliability standards will be fully demonstrated, a group of reliability public service institutions and reliability professionals will be cultivated, and the overall reliability level of my country's manufacturing industry will reach a new level , has become an important engine supporting the high-quality development of the manufacturing industry. Specifically, in the electronics industry, the basic product level will focus on improving high-end general-purpose chips such as SoC/MCU/GPU for electronic equipment, wide-bandgap semiconductor power devices such as gallium nitride/silicon carbide, precision optical components, and optical communications. The reliability level of electronic components such as devices, new sensitive components and sensors, highly adaptable sensor modules, Beidou chips and devices, chip RC components, high-speed connectors, high-end radio frequency devices, high-end electromechanical components, and LED chips . Improve high-frequency high-speed printed circuit boards and substrates, new display materials, high-efficiency photovoltaic battery materials, key materials for lithium batteries, electronic pastes, electronic resins, electronic chemicals, new display electronic functional materials, advanced ceramic substrate materials, electronic assembly Improve the performance of electronic materials such as advanced packaging materials for materials and chips, improve the technical level of component packaging and curing, uniform epitaxy, and defect control, and strengthen material analysis, destructive physical analysis, reliability test analysis, board-level reliability analysis, failure analysis, etc. Analyze and evaluate technology research and development and standard system construction, and promote application in related industries. The overall equipment and system level will focus on improving smart products such as drones, virtual reality/augmented reality (VR/AR) equipment, service robots, and smart door locks, and electronics such as exposure machines, evaporation machines, slicers, and coating machines. Special equipment, mass spectrometers, oscilloscopes, electronic lenses and other electronic measuring instruments, high-efficiency photovoltaic cells and other products, Beidou navigation terminals, 5G communication equipment and other Internet of Things terminals, high-end servers, laser printers, remote conference systems and other computers and external equipment reliability level . Reposted from: International Electronic Commerce, automatically translated by Google

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300mm wafer equipment spending may resume growth next year, reaching $118.8 billion in 2026

International Electronics Business News on the 15th According to a report released earlier this week by the International Semiconductor Industry Association (SEMI), global spending on 300mm (12-inch) fab equipment for front-end facilities is expected to decline next year, following a decline in 2023. It will start to grow continuously and is expected to reach a record high of US$118.8 billion by 2026. SEMI expects global 300mm fab equipment spending to drop 18% to $74 billion in 2023, grow 12% to $82 billion in 2024, grow 24% to $101.9 billion in 2025, and grow 17% to $101.9 billion in 2026. $118.8 billion. Strong demand for high-performance computing, automotive applications, and increased demand for memory will drive double-digit percentage growth in equipment spending over the three-year period, the association said. SEMI President and CEO Ajit Manocha said the forecasted wave of growth in equipment spending highlights strong long-term demand for semiconductors, with the foundry and memory industries set to feature prominently in this expansion, indicating demand for chips across a broad range of end markets and applications . In terms of regions, SEMI expects South Korea to lead global 300mm fab equipment spending with an investment of $30.2 billion in 2026, nearly doubling from $15.7 billion in 2023. Taiwan is expected to spend $23.8 billion in 2026, up from $22.4 billion this year, while mainland China is expected to spend $16.1 billion in 2026, up from $14.9 billion in 2023. U.S. equipment spending is expected to nearly double from $9.6 billion this year to $18.8 billion in 2026. From a market segment perspective, the foundry industry is expected to lead other areas in equipment spending in 2026, reaching $62.1 billion, up from $44.6 billion in 2023; followed by memory at $42.9 billion, up from 2023 170%; analog spending is expected to grow from $500 million to $6.2 billion in 2026; spending in microprocessors/microcontrollers, discretes (mainly power devices) and optoelectronics is expected to decline in 2026, while logic Investment is expected to rise. Reposted from: International Electronic Commerce, automatically translated by Google

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