Article Details
The principle of the dehumidification host of the electronic moisture-proof box can be roughly classified into the following three types
1. High-tech physical adsorption dehumidification
2. Frosting and dehumidification of frozen wafers
3. Heating type
Comparison of dehumidification elements
1. High-tech physical adsorption dehumidification
* With a history of 100 years of use, various drying materials that do not need to be replaced can be used repeatedly, and there is no problem that the selection of materials affects the service life. However, the formula/surface area/suction and exhaust application of the desiccant material is Know How; by making good use of this technology, various dehumidification speeds/dehumidification ranges/dehumidification control/dehumidification limits can be adjusted in the same host, which is convenient for users to use/ The rights and interests of service/upgrade are the most guaranteed.
* Dehumidification does not rely on electricity (only electricity is needed when dehumidifying) and the porous capillary moisture absorption of the drying material is almost never saturated, so it can maintain a certain dehumidification and moisture-proof function when the power is off.
*Moisture is firmly trapped by the van der Waals force in the dry material that can be reheated and recycled, and the quality of the dry material will not be affected.
*The moisture absorption capacity of the desiccant material is not affected by the low temperature of the external environment, so it can also maintain good dehumidification performance in cold and humid winters.
2. Frozen wafer dehumidification and dehumidification
*Semiconductor frozen chips that are cold and hot while being powered on, the quality of the chip and the dehumidification design of the chip will definitely affect the performance and life of the chip. Due to the dehumidification of frost (water) by the temperature difference between cold and hot, it is impossible to achieve real low humidity capability.
*If the power is cut off, the function will be completely lost, and the humidity of the frosted water will rise. If the design is not proper, it may cause floods.
*Moisture forms frost and water on the cold end of the chip. Even with waterproof treatment, the quality of the chip may still be affected by long-term soaking in water, and the process of frost and water involves continuous power failure (water)/power on (junction) Frost) all affect the quality of the wafer.
* Chip dehumidification due to the temperature difference between hot and cold of the chip In low temperature winter, due to the reduced temperature difference, the dehumidification power is weakened (such as a dehumidifier) will be insufficient for wet and cold winter.
3. Heating type
Using the principle of temperature rise and humidity drop, moisture is not removed. In the early days, there were a lot of moisture-proof cabinets for slides/official documents/microscopes/equipment, all of which were adopted in this way. Due to the effect of thermal deterioration, they were rarely (or no longer) supplied by the early 2010s, and some manufacturers switched to making them. Chip type electronic moisture-proof box
dehumidification comparison
1. High-tech physical adsorption dehumidification
Using precision ceramic PTC heating to break the van der Waals force to turn water into water vapor, supplemented by shape memory alloy precision micromechanics to open the airtight valve to exhaust. Precision ceramic heating/shape memory alloy precision micromechanical valve control are mature advanced technologies and key components that have passed the durability test of other mature commercial products.
2. Frosting and dehumidification of frozen wafers
Using the natural gravity phenomenon of frosted water + small water droplets to form water droplets to drip into the water guide hole and then use water-absorbing fiber/sponge to drain water, it is a very simple structure.
Durability comparison
1. High-tech physical adsorption dehumidification
* There are no key parts that are easy to break, and the entire dehumidification system is almost purely mechanical
*Power failure can also prevent moisture
*Function remains unchanged in wet and cold winter
* All-round dehumidification and control capabilities
*The world's largest leading brand of electronic moisture-proof boxes adopts this method, and has established a good reputation of more than one million long-term users in Taiwan/Japan (Taiwan nearly 20 years, Japan 30 years)
2. Frosting and dehumidification of frozen wafers
* The quality/design of the frozen chip itself is a place that needs to be very careful and prone to problems. The entire dehumidification system is 100% controlled and operated by the circuit.
*Power outages cannot prevent moisture and will also counteract moisture.
*Function may be weakened in wet and cold winter.
*Insufficient low humidity capability.
* It was introduced in the early days, and the reputation of durability is not good. The quality/design of the chip is still the key factor.
Comparison of the difficulty of making
1. High-tech physical adsorption dehumidification
Involves such as: drying material formula and application technology of all-round removal and humidity control/shape memory alloy quality technology/PTC heating, heat dissipation and application technology/aerodynamic application technology of natural or forced moisture in and out...etc. And key parts acquisition and quality control capabilities, so it is not easy to imitate, even if it is imitated, it is not easy to do well, which is why there are not many manufacturers based on this technology.
2. Frosting and dehumidification of frozen wafers
As long as you buy chips/circuits from frozen chip manufacturers, you can make them. This is the main reason why so many manufacturers have launched chip-type electronic moisture-proof boxes.
