According to the latest forecast from market research agency Gartner, global semiconductor revenue is expected to decline by 10.9% in 2023 to US$534 billion. This market will grow by 16.8% in 2024, reaching US$624 billion. "We have reached the end of 2023, and strong demand for chips that support artificial intelligence (AI) workloads such as graphics processing units (GPUs) will not be enough to save the semiconductor industry from a double-digit decline in 2023," Gartner vice president analyst Alan Priestley said. "Reduced demand from smartphone and PC customers, combined with softer data center/hyperscale spending, is impacting revenue declines this year." However, 2024 is expected to be a rebound year, with revenue growing across all chip types driven by double-digit growth in the memory market (see Figure 1). The agency predicts that the global memory market will decline by 38.8% in 2023 and rebound by 66.3% in 2024. Lower pricing due to weak demand and massive oversupply will result in a 38.8% decline in NAND flash revenue, which will fall to $35.4 billion in 2023. In the next 3-6 months, NAND industry pricing will bottom out and suppliers' conditions will improve. Gartner analysts predict a strong recovery in 2024, with revenue growing to $53 billion, a year-on-year increase of 49.6%. Due to severe oversupply and insufficient demand, DRAM manufacturers have lowered market prices to reduce inventory. Oversupply in the DRAM market will continue through the fourth quarter of 2023, which will trigger a price rebound. However, the full impact of the price increase will not be felt until 2024, when DRAM revenue is expected to grow 88% to $87.4 billion. Reposted from: International Electronic Commerce, automatically translated by Google

On September 28, 2023, the fifth industrial summit of STMicroelectronics, which represents the vane of smart industry development, was grandly opened at the Futian Shangri-La Hotel in Shenzhen. The world today is facing severe climate challenges. STMicroelectronics has always fulfilled its commitment to sustainable development and actively improved application energy efficiency by creating advanced optimized intelligence (digital), energy and power conversion solutions, and opened up a path to a green, low-carbon and sustainable future. The Industrial Summit is a top industry event where STMicroelectronics showcases industrial technology products and solutions. The theme of this year's summit is "Inspiring Intelligence and Continuous Innovation." Through forward-looking keynote speeches and about 30 technical seminars, STMicroelectronics let the audience understand how STMicroelectronics focuses on smart power and smart digital applications. At the same time, STMicroelectronics also displayed more than 150 solution demonstrations for the three major markets of automation, power and energy, and motor control, as well as exciting products and solutions jointly developed with customers and partners for attendees to visit and experience. STMicroelectronics executives, representatives of various product departments, regional marketing and sales leaders, as well as ST customers and partners attended the conference. Cao Zhiping, executive vice president of STMicroelectronics and president of China, delivered a welcome speech for the conference. He said that China is the engine driving the growth of the industrial market and one of ST's most important markets. Despite the impact of the epidemic in the past few years, ST has still persisted in successfully hosting industrial summits for five consecutive years. This fully reflects ST's perseverance and commitment to the industrial market. ST has never stopped technological innovation and will empower industrial market innovation and accelerate sustainable development through the latest technologies and solutions in the fast-growing Asian industrial market, especially the Chinese industrial market. Reposted from: International Electronic Commerce, automatically translated by Google

On October 18, Peter Wennink, CEO of ASML, a leading Dutch lithography machine company, said that demand from chip manufacturers in mainland China is expected to remain strong. "The demand for mature technologies in mainland China will be quite large, and I don't think it will peak this year," Wennink said at a press conference after the release of third-quarter results. The latest financial report data shows that in the third quarter of 2023, ASML achieved net sales of 6.7 billion euros, a gross profit margin of 51.9%, and a net profit of 1.9 billion euros. The value of new orders in the third quarter of this year was 2.6 billion euros, of which 500 million euros were orders for EUV lithography machines. By region, of the equipment sold by ASML in the third quarter, customers in mainland China accounted for 46%, followed by Taiwan, China, which accounted for 24%, and South Korea, which accounted for 20%. Looking forward, ASML believes that the semiconductor industry is at the bottom of the cycle, and customers are looking forward to seeing an inflection point at the end of this year. Customers are still uncertain about the recovery of demand within the industry, so we expect 2024 to be a transition year. Based on the current view, the company is conservative about 2024 and expects annual revenue to be basically the same as in 2023. At the same time, 2024 will also be an important year to lay the foundation for substantial growth in 2025. Reposted from: International Electronic Commerce, automatically translated by Google

MSL: MSL is the abbreviation of Moisture Sensitivity Level, which means the moisture sensitivity level. MSL is proposed to provide a classification standard for the packaging of moisture-sensitive SMD components, so that different types of components can be packaged, stored and handled correctly, and accidents can be avoided during assembly or repair. Generally, the packaged IC, colloid or Substrate PCB will absorb moisture in a normal environment, resulting in "popcorn" (POPCORN) when the IC goes through SMT reflow soldering. Moisture Sensitivity Level (MSL) is used to define the level of IC in terms of moisture absorption and shelf life. If the IC exceeds the shelf life, there is no guarantee that it will not absorb too much moisture and cause POPCORN during SMT reflow soldering . Therefore, bake the IC beyond the shelf life. The process of MSL determination is: (1) Carry out SAT on the good product IC to confirm that there is no delamination. (2) Bake the IC to completely remove moisture. (3) Humidification according to MSL level. (4) Pass IR-Reflow 3 times (analog IC assembly, maintenance dismantling, maintenance and assembly). (5) SAT inspection for delamination and IC test function. If it can pass the above test, it means that the IC package meets the MSL level. The classification of MSL has 8 levels, as follows: Class 1 - Less than or equal to 30°C/85% RH Unlimited workshop life Class 2 - Less than or equal to 30°C/60% RH One year workshop life Class 2a - Less than or equal to 30°C/60% RH Four week workshop life Class 3 - Less than or equal to 30°C/60% RH 168 hours workshop life Class 4 - Less than or equal to 30°C/60% RH 72 hours workshop life Class 5 - Less than or equal to 30°C/60% RH 48 hours workshop life Class 5a - Less than or equal to 30°C/60% RH 24 hour workshop life Class 6 - Less than or equal to 30°C/60% RH 72 hours floor life (for Class 6, components must be baked prior to use and must be reflowed within the time limit specified on the Moisture Sensitive Caution Label) Moisture not only seriously accelerates the damage of electronic components, but also has a huge impact on the components during the soldering process. This is because the component soldering on the product production line is performed at high temperature by wave soldering or reflow soldering and automatically by the soldering equipment. Completed. When the components are fixed to the PCB board, the rapid heating of reflow soldering will create pressure inside the components. Due to the different coefficient of thermal expansion (CTE) rates of different package structure materials, it may cause stress that the component package cannot bear. When the components are exposed to reflow soldering, the moisture inside the SMD components can generate enough vapor pressure to damage or destroy the components due to the rising temperature environment. Common conditions include plastic separation (delamination) from the inside of the chip or lead frame, gold wire solder damage, chip damage, and cracks inside the component (not visible on the component surface). In some extreme cases, cracks can extend to the surface of the component, and in severe cases, the component bulges and pops (called the "popcorn" effect). Although a small amount of moisture is acceptable at 180°C to 200°C during reflow soldering operations, any presence of humidity in lead-free processes in the range of 230°C to 260°C can form enough to cause damage to the package. Small explosions (popcorn-like) or layers of material. Therefore, it is necessary to choose wise packaging materials, carefully control the assembly environment, and adopt measures such as sealing packaging and placing desiccant during transportation. In fact, foreign countries often use humidity tracking systems equipped with radio frequency tags, local control units and special software to display and control the humidity in packaging, testing lines, transportation/operation and assembly operations in real time.

Precision oven suits baking for electronic components, rubber, plastics, decorative materials, which has stricter requirement on temperature uniformity. As a professional precision oven manufacturer, EJER has mature production technology, reliable after-sales service, professional technical guidance, bring users a different experience. Today we introduce our precision oven features, so you can have a preliminary understanding about the difference between precision oven and ordinary industrial oven. 1. Structure 1.1 The equipment consists of studio, heating system, electrical control, air supply system, protection system, etc. 1.2 The oven is made of excellent manufacturing facilities, high quality process, beautiful and generous. 1.3 Studio is made by stainless steel 304, the exterior oven is high-quality cold-rolled steel plate, the product surface using environmental painting, the overall design beautiful, suitable for a variety of laboratories. 1.4 Workroom partitions can adjust the height and number of partitions as required by the user. 1.5 The insulation material is superfine glass fiber wool, insulation layer thickness>70mm, insulation effect is optimal, high performance insulation structure, from inside to outside with inner cavity, inner shell, ultra-fine glass fiber, aluminum reflective aluminum foil sheet, air sandwich, door and door frame is rubber sealing structure, good sealing, high temperature resistance, good aging resistance. 1.6 The air duct in the oven is composed of a double circulation system, a stainless steel multi-wing centrifugal fan and a circulating air duct. The heat of the electric heater placed in the main part of the oven is removed through the side air duct and then inhaled by the back centrifugal wind turbine after drying. the ability of air flow heating is improved, and the temperature uniformity of oven is improved. 1.7 Stainless steel heating tube for heater, fast heating and long lifespan. Adopting imported LCD controller, the product adopts integrated EMC design and humanized menu design, which makes the equipment operation completely simplified and temperature control effect is good. High brightness LCD display, clear and intuitive. microcomputer PID intelligent control. After setting the temperature and time, the instrument controls the heating power automatically, and displays the heating state, and the temperature control is accurate and stable. Over-temperature alarm and automatically cut off the power supply. 2. Electrical control system 2.1 Famous brands are used for electrical control components. 2.2 Electrical wiring design is practical, reasonable wiring, safe and reliable. 2.3 The top of the oven is an electrical control cabinet for easy inspection and maintenance. 3. Protection system 3.1 Over-temperature alarm 3.2 Short phase and reverse phase protection 3.3 Overcurrent protection 3.4 Fast fuse 3.5 Ground protection In a summary, compared with ordinary industrial ovens, precision oven temperature uniformity, precision oven temperature control degree, operation control and so on are much more strict, more suitable for electronic components, rubber, plastic, decorative materials and other industries.

The vacuum oven is divided into two categories: one is benchtop vacuum oven, the other is the vertical vacuum oven, so what is the specific difference? What is in the common? Difference: Benchtop vacuum oven standard configuration does not include vacuum pump, customers need to add vacuum pump outside the oven, it is an option. Vertical vacuum oven standard configuration consist of upper body and lower body, that is, above is the studio, below is the vacuum pump cabinet (including vacuum pump), no need to match the vacuum pump additionally, it is more convenient to use. Common Points: The common points between vertical and benchtop vacuum oven is that they are widely used in biochemistry, chemical pharmaceuticals. Medical and health, agricultural research, environmental protection and other research fields, for powder drying, baking and all kinds of glassware disinfection and sterilization. Especially suitable for drying heat sensitive, easy to decompose, easy to oxidize substances and complex components for rapid drying treatment.