Technical information

What is the moisture sensitivity MSL level of IC components

MSL: MSL is the abbreviation of Moisture Sensitivity Level, which means the moisture sensitivity level. MSL is proposed to provide a classification standard for the packaging of moisture-sensitive SMD components, so that different types of components can be packaged, stored and handled correctly, and accidents can be avoided during assembly or repair. Generally, the packaged IC, colloid or Substrate PCB will absorb moisture in a normal environment, resulting in "popcorn" (POPCORN) when the IC goes through SMT reflow soldering. Moisture Sensitivity Level (MSL) is used to define the level of IC in terms of moisture absorption and shelf life. If the IC exceeds the shelf life, there is no guarantee that it will not absorb too much moisture and cause POPCORN during SMT reflow soldering . Therefore, bake the IC beyond the shelf life. The process of MSL determination is: (1) Carry out SAT on the good product IC to confirm that there is no delamination. (2) Bake the IC to completely remove moisture. (3) Humidification according to MSL level. (4) Pass IR-Reflow 3 times (analog IC assembly, maintenance dismantling, maintenance and assembly). (5) SAT inspection for delamination and IC test function. If it can pass the above test, it means that the IC package meets the MSL level. The classification of MSL has 8 levels, as follows: Class 1 - Less than or equal to 30°C/85% RH Unlimited workshop life Class 2 - Less than or equal to 30°C/60% RH One year workshop life Class 2a - Less than or equal to 30°C/60% RH Four week workshop life Class 3 - Less than or equal to 30°C/60% RH 168 hours workshop life Class 4 - Less than or equal to 30°C/60% RH 72 hours workshop life Class 5 - Less than or equal to 30°C/60% RH 48 hours workshop life Class 5a - Less than or equal to 30°C/60% RH 24 hour workshop life Class 6 - Less than or equal to 30°C/60% RH 72 hours floor life (for Class 6, components must be baked prior to use and must be reflowed within the time limit specified on the Moisture Sensitive Caution Label) Moisture not only seriously accelerates the damage of electronic components, but also has a huge impact on the components during the soldering process. This is because the component soldering on the product production line is performed at high temperature by wave soldering or reflow soldering and automatically by the soldering equipment. Completed. When the components are fixed to the PCB board, the rapid heating of reflow soldering will create pressure inside the components. Due to the different coefficient of thermal expansion (CTE) rates of different package structure materials, it may cause stress that the component package cannot bear. When the components are exposed to reflow soldering, the moisture inside the SMD components can generate enough vapor pressure to damage or destroy the components due to the rising temperature environment. Common conditions include plastic separation (delamination) from the inside of the chip or lead frame, gold wire solder damage, chip damage, and cracks inside the component (not visible on the component surface). In some extreme cases, cracks can extend to the surface of the component, and in severe cases, the component bulges and pops (called the "popcorn" effect). Although a small amount of moisture is acceptable at 180°C to 200°C during reflow soldering operations, any presence of humidity in lead-free processes in the range of 230°C to 260°C can form enough to cause damage to the package. Small explosions (popcorn-like) or layers of material. Therefore, it is necessary to choose wise packaging materials, carefully control the assembly environment, and adopt measures such as sealing packaging and placing desiccant during transportation. In fact, foreign countries often use humidity tracking systems equipped with radio frequency tags, local control units and special software to display and control the humidity in packaging, testing lines, transportation/operation and assembly operations in real time.

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Precision Oven

Precision oven suits baking for electronic components, rubber, plastics, decorative materials, which has stricter requirement on temperature uniformity. As a professional precision oven manufacturer, EJER has mature production technology, reliable after-sales service, professional technical guidance, bring users a different experience. Today we introduce our precision oven features, so you can have a preliminary understanding about the difference between precision oven and ordinary industrial oven. 1. Structure 1.1 The equipment consists of studio, heating system, electrical control, air supply system, protection system, etc. 1.2 The oven is made of excellent manufacturing facilities, high quality process, beautiful and generous. 1.3 Studio is made by stainless steel 304, the exterior oven is high-quality cold-rolled steel plate, the product surface using environmental painting, the overall design beautiful, suitable for a variety of laboratories. 1.4 Workroom partitions can adjust the height and number of partitions as required by the user. 1.5 The insulation material is superfine glass fiber wool, insulation layer thickness>70mm, insulation effect is optimal, high performance insulation structure, from inside to outside with inner cavity, inner shell, ultra-fine glass fiber, aluminum reflective aluminum foil sheet, air sandwich, door and door frame is rubber sealing structure, good sealing, high temperature resistance, good aging resistance. 1.6 The air duct in the oven is composed of a double circulation system, a stainless steel multi-wing centrifugal fan and a circulating air duct. The heat of the electric heater placed in the main part of the oven is removed through the side air duct and then inhaled by the back centrifugal wind turbine after drying. the ability of air flow heating is improved, and the temperature uniformity of oven is improved. 1.7 Stainless steel heating tube for heater, fast heating and long lifespan. Adopting imported LCD controller, the product adopts integrated EMC design and humanized menu design, which makes the equipment operation completely simplified and temperature control effect is good. High brightness LCD display, clear and intuitive. microcomputer PID intelligent control. After setting the temperature and time, the instrument controls the heating power automatically, and displays the heating state, and the temperature control is accurate and stable. Over-temperature alarm and automatically cut off the power supply. 2. Electrical control system 2.1 Famous brands are used for electrical control components. 2.2 Electrical wiring design is practical, reasonable wiring, safe and reliable. 2.3 The top of the oven is an electrical control cabinet for easy inspection and maintenance. 3. Protection system 3.1 Over-temperature alarm 3.2 Short phase and reverse phase protection 3.3 Overcurrent protection 3.4 Fast fuse 3.5 Ground protection In a summary, compared with ordinary industrial ovens, precision oven temperature uniformity, precision oven temperature control degree, operation control and so on are much more strict, more suitable for electronic components, rubber, plastic, decorative materials and other industries.

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Application of Benchtop Temperature Test Chamber

Application: Suitable for testing the adaptability of instrument materials, electrician, electronic products, household appliances, auto-friction accessories, chemical coatings, aerospace products and other related products in high and low temperature environment. The experimental equipment is mainly suitable for the reliability experiment of constant temperature alternating of industrial products, and carries on the environmental simulation test to the physical and other related characteristics of the product to judge whether the performance of the product can still meet the predetermined requirements, so as to facilitate the design, improvement, appraisal and factory inspection of the product. Structure: The equipment is mainly composed of body, heating system, refrigeration system, air circulation system and control system. The benchtop design is perfect, the CNC machine is used to process and form, and the non-reaction handle is used, and the operation is easy. The door seal adopts refined silicone rubber, so there is no aging and hardening at high and low temperature. The working chamber is sus#304 stainless steel plate, the shell is A3 plate spray treatment, more bright and beautiful. The insulation system is filled with superfine glass fiber to ensure the temperature insulation inside. Independent heating and cooling system makes the equipment more effective heating and cooling, refrigeration system for automatic control and safety protection coordination system. Using multi-wing strong air circulation to avoid any dead angle, the temperature distribution in the test area can be uniform. Air circulation air return design, wind pressure and wind speed are in line with the test standards, and can open the door instant temperature return time fast. Customer can choose freely as per demands, for details, pls visit our website:

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